Technical
Program
Thursday, September
29, 2005
*All Technical Sessions will be held in the Pennsylvania Convention
Center. Room locations will be made available closer to the
show date.
THA1 | THA2 | THA3 | THA4 | THA5 | THA6 | THA7 | THA8
THP1 | THP2 | THP3 | THP4
Tuesday
Sessions | Wednesday Sessions
Register
On-line
THA1
Wirebonding (Gold)
Chairs: Lee Levine, Kulicke & Soffa Industries Inc.; Bruce Romenesko,
The Johns Hopkins University/APL
8:00 am – 8:50 am
Papers cancelled; one paper
moved to WA6
THA2
Power Packaging (Si and SiC)
Chairs: Doug Hopkins, University at Buffalo; Herb Dwyer, SATCON
Electronics
8:00 am – 9:15 am
Packing power into a small area has provided many challenges. Listen
how planar interconnect techniques can offer higher performance and
functionality for Si devices. Take the gloves off for very high power
density and drive SiC devices up to 300C. Listen to the latest in high
temperature packaging and interconnection metallurgy.
Titanium-Tungsten (Ti10 W90) as a Diffusion Barrier on AlN and SiN
Substrates for SiC Power Devices
Habib Abul Mustain, Alexander B. Lostetter, William D. Brown,
University of Arkansas
Power Device Assembly Materials and Processes for Extreme Environments
Yi Liu, Cai Wang, R. Wayne Johnson, Auburn University
Electroplated Nickel Phosphorous for use in Wire Bonding Applications
Michael J. Brouillard, Sumco Incorporated
THA3
Reliability II (Test Methods)
Chairs: Changhan Yun, Analog Devices Inc.; Harry K. Charles,
Jr., The Johns Hopkins University/APL
8:00 am – 9:15 am
This session on Reliability addresses failure mechanisms in both devices
and packages. There are presentations on the studies of the failure
mechanisms themselves, testing for failure and lifetime modeling. This
session focuses on the mechanisms and test methods.
MEMS Reliability Assessment Program for DOD Activities
James Zunino, Donald Skelton, Robert Mason, U.S. Army ARDEC
Systematic
Study of the Digital Image Correlation Technique through a Paired
One-to-One Comparison
with
Moiré Interferometry
Pat Kelly, Liam Keogh, Vincent Guenebaut, Optical Metrology
Innovations (OMI); Mike Mello, Steve Cho, Intel Corporation
Dynamic Response of a Portable Electronic Product subjected to an Impact
Load
Jiang Zhou, Manish P. Stilani, Lamar University
THA4
Substrate Advances in Packaging
Chairs: Warren Dyckman, IBM, Tim Mobley, DuPont Electronic
Technologies
8:00 am – 9:15 am
New and innovative substrate packaging technologies are continuously
being developed to keep up with market needs for increased performance,
reliability, miniaturization, and lower cost. This session looks at
some of the latest advances in microvia technology, fine line interconnects,
chip first strategies, elastomeric interconnect, high temperature ceramics,
and multilayer interconnect strategies. The relationship of these areas
is examined relative to system integration, reliability testing, and
performance.
Environmental Evaluation of Vertical RF Interconnections for T/R-Modules
for Multirole Phased Array Systems
Lovisa Bjorklund, Mattias Nilsson, Klas Axelsson, Mikael Johansson,
Ericsson Microwave Systems AB
Thick Film Copper Metallization in Ambient Air using Selective Laser
Sintering
Edward Kinzel, Hjalti Sigmarsson, Xianfan Xu, William Chappell,
Purdue University
Microvia-in-Pad Technology Challenges on BGA Package Performance
Wendy Chet Ming Ngoh, Intel Products (M) Sdn Bhd.
THA5
3D Packaging & High Density Substrates
Chairs: Rajen Chanchani, Sandia National Laboratories; Daniel
Amey, DuPont Microcircuit Materials
9:45 am – 11:00 am
This session will be focusing on the latest developments in 3D packaging
in high density interconnect substrates.
Photo-Formable
Tape-on-Substrate Material System for Multilayer Hybrid Manufacturing
Christopher R. Needes, Barry E. Taylor, Larry A. Bidwell, Michael
A. Skurski, Michael A. Champ, Anthony T. Orzel, K. Mani Nair, Mark F.
McCombs, Richard R. Draudt, DuPont Company
Development of High Density 3D-Stacked Package for SiP
Yoshimichi Sogawa, NEC Corporation
Aligned Fusion Wafer Bonding for Wafer-Level-Packaging and 3D Integration
Thorsten Matthias, Viorel Dragoi, Shari Farrens, Paul Lindner,
EV Group
THA6
Flip Chip (Solder Attach)
Chairs: Roupen Keusseyan, DuPont Microcircuit Materials; Jamin
Ling, Kulicke & Soffa Industries Inc.
9:45 am – 11:25 am
Most flip chip devices are interconnected by solder joints. The development
and reliability of the solder interconnection is the focus of this session.
Microstructure Study of Electroless Nickel Gold Under Bump Metallurgy
Pb-Free Solder Bumps
Mohamed Mohd Salleh, Universiti Kebangsaan Malaysia
Effects of Solder Bump UBM Reliability and Electromigration Characteristics
of Flip Chip Package
Rick Yu, Tom Tai, Kelly Lee, Jowel Taguibao, Mars Tsai, Homing
Tong, Advanced Semiconductor Engineering, Inc. (ASE)
Uniformity Control of Solder Ball Heights in Stencil Printing Process
for Flip Chip Bumped Wafer for High Speed Memory
Jin-Woo Lee, J.-D. Kim, Samsung Techwin Co., Ltd.
Gold Stud Bumped Flip Chips: Surface Mounting and Joint Integrity with
Thermal Cycling
Nagadeepthi Kurra, Z. J. Delalic, Temple University; Terence
Clark, Visteon Corp.; Lee Levine, K&S Industries Inc.
THA7
Manufacturing III: Polymer & Solder Processes
Chairs: Lyndon Larson, Dow Corning; Raymond Pearson, Lehigh
University
9:45 am – 11:00 am
Understanding material characteristics and material interfaces is key
to proper application of a material in electronics packaging. This session
focuses on understanding or improving the interfaces and the characteristics
of polymers and solder used in electronics assembly.
Process Modeling of Underfill Cure in Flip-Chip Packaging
Rajesh R. Gomatam, John P. Coulter, Lehigh University
Application Performances of Glob-top Encapsulants
John Cheng, Randy Hamm, Jim Sim, Honeywell Federal Manufacturing & Technologies
Upper and Lower Bound Theoretical Analysis in Characterizing Hygroscopic
Swelling of Polymeric Materials in Electronic Packaging
Jiang Zhou, Lamar University
THA8
Sensors and MEMS
Chairs: Janet Lumpp, University of Kentucky; David Galipeau,
South Dakota State University
9:45 am – 11:25 am
Sensors and MEMS development continues to be an area of high national
and international interest due to the need for improved homeland security.
This session highlights new developments in gas and pressure sensors
as well as MEMS resonators and switches.
Effect of Temperature, Percentage of Polymer Content and Substrate
on Gas Sensing Properties of NiO Based Materials
Khalil Arshak, Ibrahim Gaidan, University of Limerick
Effect of Changing Finger Number and Spacing of Interdigitated Electrodes
on the Sensitivity of Oxide/Polymer Gas Sensors
Khalil Arshak, Ibrahim Gaidan, University of Limerick
Packaging and RF Telemetry System for Biocompatible Wireless Pressure
Sensor
Shankaran Janardhanan, Joan Z. Delalic, Michael Ruggieri, Alan
Braverman, Temple University; Jeffrey Catchmark, Penn State University
Q-Factor Enhancement for MEMS Devices: The Role of the Getter Film
Giorgio Longoni, A. Bonucci, A. Conte, M. Moraja, M. Amiotti,
SAES Getters Italy; W. Reinert, FhG-ISIT
THP1
3D Packaging & High Density Substrates
Chairs: Rajen Chanchani, Sandia National Laboratories; Daniel
Amey, DuPont Microcircuit Materials
12:30 pm – 1:45 pm
This session will be focusing on the latest dvelopments in 3D packaging
in high density interconnect substrates.
Interconnection of Fine Lines to Micro Vias in High Density Multilayer
LTCC Substrates
Gangqiang Wang, Fred Barlow, Aicha Elshabini, University of
Arkansas
A Multichip Module Implementation of a Radiation Tolerant Microprocessor
for Space Applications
Thomas F. Marinis, Gregory H. Barton, Dariusz R. Pryputniewicz,
Draper Laboratory
Low Temperature Co-Fired Ceramics Multi-Layer Substrate Utilized with
Ink-Jet Printed Silver Layers
Koji Koiwai, Toshiyuki Sakuma, Yuki Kawamura, Shoko Yamaguchi,
KOA Corporation; Kenji Wada, Kazuaki Sakurada, Toshiyuki Kobayashi,
Seiko Epson Corporation
THP2
Flip Chip (Solder Attach)
Chairs: Roupen Keusseyan, DuPont Microcircuit Materials; Jamin
Ling, Kulicke & Soffa Industries Inc.
12:30 pm – 1:45 pm
Most flip chip devices are interconnected by solder joints. The development
and reliability of the solder interconnection is the focus of this session.
The IMC Micro-Structure of Solder Joint to Correlate with Mechanical
Drop Performance in SnAgCu CSP Packages
Jeffrey C. B. Lee, Advanced Semiconductor Engineering Group
Effect of Test Conditions on Electromigration Reliability of SnAgCu
Flip-Chip Solder Bumps
Yi-Shao Lai, Chiu-Wen Lee, Yu-Hsiu Shao, Advanced Semiconductor
Engineering, Inc.
Design Challenges of a Pb-free WLCSP
Glenn A. Rinne, Unitive Electronics Inc.
THP3
Manufacturing III: Polymer & Solder Processes
Chairs: Lyndon Larson, Dow Corning; Raymond Pearson, Lehigh
University
12:30 pm – 1:45 pm
Understanding material characteristics and material interfaces is key
to proper application of a material in electronics packaging. This session
focuses on understanding or improving either the interfaces and the
characteristics of polymers and solder used in electronics assembly.
Adhesion Failure Analysis between Photosensitive Solder Mask and Die
Attach Adhesive using TOF-SIMS in PBGA Packaging
Min Woo Lee, Chan Yok Park, Amkor Technology Korea, R&D
Preventing Adhesive Resin Bleed in Microelectronics Assembly through
Gas Plasma Technology
Martin J. Burmeister, James Getty, Lou Fierro, Stellar Microelectronics,
Inc.
Surface Morphology and Elemental Analysis Study on Non-Wetting Problem
at Die Top
Mohamed Mohd Salleh, Universiti Kebangsaan Malaysia
THP4
Sensors and MEMS
Chairs: Janet Lumpp, University of Kentucky; David Galipeau,
South Dakota State University
12:30 pm – 1:45 pm
Sensors and MEMS development continues to be an area of high national
and international interest due to the need for improved homeland security.
This session highlights new developments in gas and pressure sensors
as well as MEMS resonators and switches.
Bi-Stable MEMS Switch with Low Actuation Voltage
Narendra V. Lakamraju, Stephen M. Phillips, Arizona State University
An Effective Simplified Way to obtain the Pull-Down Voltage for MEMS
Switches
Joshua Liu, Motorola Inc.
Development of a Freon Gas Sensor using a Low Power 700oC Microheater
in Low Temperature Cofire Ceramic
W. Kinzy Jones, Mary Ruales, Jain Wang, Florida International
University
THA1 | THA2 | THA3 | THA4 | THA5 | THA6 | THA7 | THA8
THP1 | THP2 | THP3 | THP4
Tuesday
Sessions | Wednesday
Sessions
Register
On-line
